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MC75172B, MC75174B Quad EIA-485 Line Drivers with Three-State Outputs
The ON Semiconductor MC75172B/174B Quad Line drivers are differential high speed drivers designed to comply with the EIA-485 Standard. Features include three-state outputs, thermal shutdown, and output current limiting in both directions. These devices also comply with EIA-422-A, and CCITT Recommendations V.11 and X.27. The MC75172B/174B are optimized for balanced multipoint bus transmission at rates in excess of 10 MBPS. The outputs feature wide common mode voltage range, making them suitable for party line applications in noisy environments. The current limit and thermal shutdown features protect the devices from line fault conditions. These devices offer optimum performance when used with the MC75173 and MC75175 line receivers. Both devices are available in 16-pin plastic PDIP and 20-pin wide body surface mount packages.
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QUAD EIA-485 LINE DRIVERS
SOIC-20 WB DW SUFFIX CASE 751D 1
* * * * * * * * * * * *
Meets EIA-485 Standard for Party Line Operation Meets EIA-422-A and CCITT Recommendations V.11 and X.27 Operating Ambient Temperature: -40C to +85C High Impedance Outputs Common Mode Output Voltage Range: -7.0 to 12 V Positive and Negative Current Limiting Transmission Rates in Excess of 10 MBPS Thermal Shutdown at 150C Junction Temperature, (20C) Single 5.0 V Supply Pin Compatible with TI SN75172/4 and NS mA96172/4 Interchangeable with MC3487 and AM26LS31 for EIA-422-A Applications Pb-Free Packages are Available*
PDIP-16 P SUFFIX CASE 648 1
MARKING DIAGRAMS
20 MC17517xBDW AWLYYWWG 1
MAXIMUM RATING
Rating Power Supply Voltage Input Voltage (Data, Enable) Input Current (Data, Enable) Applied Output Voltage, when in 3-State Condition (VCC = 5.0 V) Applied Output Voltage, when VCC = 0 V Output Current Storage Temperature Symbol VCC Vin Iin Vza Vzb IO Tstg Value -0.5, +7.0 +7.0 -24 -10, +14 14 Self-Limiting -65, +150 Unit Vdc Vdc mA Vdc Vdc - C 1 16
MC75174BP AWLYYWWG
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Devices should not be operated at these limits. The "Recommended Operating Conditions" table provides for actual device operation. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
x A WL YY WW G
= 2 or 4 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.
1
July, 2006 - Rev. 4
Publication Order Number: MC75172B/D
MC75172B, MC75174B
RECOMMENDED OPERATING CONDITIONS
Characteristic Power Supply Voltage Input Voltage (All Inputs) Output Voltage in 3-State Condition, or when VCC = 0 V Output Current (Normal data transmission) Operating Ambient Temperature (see text) EIA-485 EIA-422 2. All limits are not necessarily functional concurrently. Symbol VCC Vin Vcm IO TA -40 0 Min +4.75 0 -7.0 -65 Typ +5.0 - - - - Max +5.25 VCC +12 +65 +85 Unit Vdc Vdc Vdc mA C
ELECTRICAL CHARACTERISTICS (-40C p TA p 85C, 4.75 V p VCC p 5.25 V, unless otherwise noted.)
Characteristic Output Voltage Single-Ended Voltage IO = 0 High @ IO = -33 mA Low @ IO = +33 mA Differential Voltage Open Circuit (IO = 0) RL = 54 W (Figure 1) Change in Differential*, RL = 54 W (Figure 1) Differential Voltage, RL = 100 W (Figure 1) Change in Differential*, RL = 100 W (Figure 1) Differential Voltage, -7.0 V p Vcm p 12 V (Figure 2) Change in Differential*, -7.0 V p Vcm p 12 V (Figure 2) Offset Voltage, RL = 54 W (Figure 1) Change in Offset*, RL = 54 W (Figure 1) Output Current (Each Output) Power Off Leakage, VCC = 0, -7.0 V p VO p 12 V Leakage in 3-State Mode, -7.0 V p VO p 12 V Short Circuit Current to Ground Short Circuit Current, -7.0 V p VO p 12 V Inputs Low Level Voltage (Pins 4 & 12, MC75174B only) Low Level Voltage (All Other Pins) High Level Voltage (All Inputs) Current @ Vin = 2.7 V (All Inputs) Current @ Vin = 0.5 V (All Inputs) Clamp Voltage (All Inputs, Iin = -18 mA) Thermal Shutdown Junction Temperature Power Supply Current (Outputs Open, VCC = 5.25 V) Outputs Enable Outputs Disabled Symbol Min Typ Max Unit Vdc VO VOH VOL VOD1 VOD2 DVOD2 VOD2A DVOD2A VOD3 DVOD3 VOS DVOS IO(off) IOZ IOSR IOS VIL(A) VIL(B) VIH IIH IIL VIK Tjts ICC - - 60 30 70 40 0 - - 1.5 1.5 - - - 1.5 - - - -50 -50 -150 -250 0 0 2.0 - -100 -1.5 - - 4.0 1.6 3.4 2.3 5.0 2.2 5.0 - 5.0 2.9 5.0 0 0 - - - - - 0.2 -15 - +150 6.0 - - 6.0 5.0 200 - 200 5.0 200 - 200 +50 +50 +150 +250 0.7 0.8 VCC 20 - - - mA Vdc C mA mVdc Vdc mVdc Vdc mVdc Vdc mVdc mA mA Vdc
3. *Vin switched from 0.8 to 2.0 V. Typical values determined at 25C ambient and 5.0 V supply.
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MC75172B, MC75174B
TIMING CHARACTERISTICS (TA = 25C, VCC = 5.0 V)
Characteristics Propagation Delay - Input to Single-ended Output (Figure 3) Output Low-to-High Output High-to-Low Propagation Delay - Input to Differential Output (Figure 4) Input Low-to-High Input High-to-Low Differential Output Transition Time (Figure 4) Skew Timing tPLHD - tPHLD for Each Driver Max - Min tPLHD Within a Package Max - Min tPHLD Within a Package Enable Timing Single-ended Outputs (Figure 5) Enable to Active High Output Enable to Active Low Output Active High to Disable (using Enable) Active Low to Disable (using Enable) Enable to Active High Output (MC75172B only) Enable to Active Low Output (MC75172B only) Active High to Disable (using Enable, MC75172B only) Active Low to Disable (using Enable, MC75172B only) Differential Outputs (Figure 6) Enable to Active Output Enable to Active Output (MC75172B only) Enable to 3-State Output Enable to 3-State Output (MC75172B only) Symbol tPLH tPHL tPLH(D) tPHL(D) tdr, tdf tSK1 tSK2 tSK3 Min - - - - - - - - Typ 23 18 15 17 19 0.2 1.5 1.5 Max 30 30 ns 25 25 25 - - - ns tPZH(E) tPZL(E) tPHZ(E) tPLZ(E) tPZH(E) tPZL(E) tPHZ(E) tPLZ(E) tPZD(E) tPZD(E) tPDZ(E) tPDZ(E) - - - - - - - - - - - - 48 20 35 30 58 28 38 36 47 56 32 40 60 30 45 50 70 35 50 50 ns - - - - ns ns Unit ns
PIN CONNECTIONS
MC75172B
1A 1 1Y 2 NC 3 1Z 4 En 5 2Z 6 NC 7 2Y 8 2A 9 GND 10 DW Package 20 VCC 19 4A 18 4Y 17 NC 16 4Z 15 En 14 3Z 13 NC 12 3Y 11 3A 1A 1 1Y 2 1Z 3 En 4 12 2Z 5 2Y 6 2A 7 GND 8 P Package
MC75174B
16 VCC 15 4A 14 4Y 13 4Z 12 En 34 11 3Z 10 3Y 9 3A 1A 1 1Y 2 NC 3 1Z 4 En 5 12 2Z 6 NC 7 2Y 8 2A 9 GND 10 DW Package 20 VCC 19 4A 18 4Y 17 NC 16 4Z 15 En 34 14 3Z 13 NC 12 3Y 11 3A
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MC75172B, MC75174B
VCC Vin (0.8 or 2.0 V) RL/2 VOD2,A RL/2 VOS Vin (0.8 or 2.0 V) VCC 375 VOD3 58 375 + VCM = 12 to -7.0 V
Figure 1. VDD Measurement
Figure 2. Common Mode Test
3.0 V VCC Vin Y Z S.G. Output Z tPHL 3.0 V 2.3 V 27 W Output 15 pF Output Y 3.0 V 3.0 V VOL tPLH 3.0 V VOH Vin 1.5 V tPLH tPHL 1.5 V 0V
Figure 3. Propagation Delay, Single-Ended Outputs
3.0 V VCC Vin Vin 54 50 pF VOD 1.5 V tPLHD 1.5 V 0V tPHLD 1.5 V 50% -1.5 V tdf
S.G.
VOD
1.5 V 50% -1.5 V
[4.6 V
NOTES:
tdr 1.S.G. set to: f p 1.0 MHz; duty cycle = 50%; tr, tf, p 5.0 ns. 2.tSK1 = tPLHD - tPHLD for each driver. 3.tSK2 computed by subtracting the shortest tPLHD from the longest tPLHD of the 4 drivers within a package. 4.tSK3 computed by subtracting the shortest tPHLD from the longest tPHLD of the 4 drivers within a package.
Figure 4. Propagation Delay, Differential Outputs
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MC75172B, MC75174B
VCC Vin 0 or 3.0 V Vin 3.0 V S.G. 50 pF Vout 2.3 V 0.5 V Vout 110W 1.5 V tPZH(E) 3.0 V 1.5 V 0V tPHZ(E) VOH
VCC 110W 0 or 3.0 V 50 pF Vin 3.0 V
VCC Vin Vout 1.5 V tPZL(E)
3.0 V 1.5 V 0V tPLZ(E)
Vout
2.3 V
0.5 V
S.G.
VOL
Figure 5. Enable Timing, Single-Ended Outputs
VCC Vin 0 or 3.0 V Vin 3.0 V VOD 0 S.G. 54 50 pF VOD
3.0 V 1.5 V tPZD(E) tPDZ(E) 1.5 V 0V
1.5 V Disabled
1.5 V 0 Active Disabled
NOTES:
1.S.G. set to: f p 1.0 MHz; duty cycle = 50%; tf, tf, p 5.0 ns. 2.Vin is inverted for Enable measurements.
Figure 6. Enable Timing, Differential Outputs
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MC75172B, MC75174B
2.0 VOL, OUTPUT VOLTAGE (V) 2.0
VOL, OUTPUT VOLTAGE (V)
1.5
1.75 IOL = 20.0 mA 1.5
IOL = 27.8 mA
1.0
0.5 4.75V p VCC p5.25 V TA = 25C 0 0 10 20 30 40 50 IOL, OUTPUT CURRENT (mA) 60 70
1.25
4.75 V p VCC p 5.25 V
1.0 - 40
- 20
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
85
Figure 7. Single-Ended Output Voltage versus Output Sink Current
Figure 8. Single-Ended Output Voltage versus Temperature
5.0 VOH, OUTPUT VOLTAGE (V)
VCC = 5.25 V VOH, OUTPUT VOLTAGE (V) VCC = 5.00 V
4.0
IOH = -20.0 mA
4.0 VCC = 4.75 V 3.0
3.75
IOH = -27.8 mA
3.5 VCC = 4.75 V 3.25
2.0 TA = 25C 1.0
0
- 10
- 20 - 30 - 40 - 50 IOH, OUTPUT CURRENT (mA)
- 60
- 70
- 40
- 20
0 40 60 20 TA, AMBIENT TEMPERATURE (C)
85
Figure 9. Single-Ended Output Voltage versus Output Source Current
Figure 10. Single-Ended Output Voltage versus Temperature
VOD , DIFFERENTIAL OUTPUT VOLTAGE (V)
VOD , DIFFERENTIAL OUTPUT VOLTAGE (V)
4.0
4.0
3.0 VCC = 5.25 V 2.0 VCC = 5.0 V VCC = 4.75 V
3.0 IO = 20.0 mA 2.0 IO = 27.8 mA
1.0 0.8 or 2.0 V 0 0 10 20 30 40 50 IO, OUTPUT CURRENT (mA) 60 70 IO VOD TA = 25C
1.0 0.8 or 2.0 V 0 -40 -20 IO VOD VCC = 4.75 V 85
0 20 40 60 TA, AMBIENT TEMPERATURE (C)
Figure 11. Output Differential Voltage versus Load Current
Figure 12. Output Differential Voltage versus Temperature
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MC75172B, MC75174B
2.0 IOX, IOZ, LEAKAGE CURRENT ( A) IOZ, LEAKAGE CURRENT ( A) 20 15 10 5.0 0 Vout = 7.0 V Vout = +12 V
1.0
0
-5.0 -10 -15 -20 -40 -20
-1.0 TA = 25C En = Low, En = High -2.0 -7.0 -3.0 1.0 5.0 9.0 Vz, APPLIED OUTPUT VOLTAGE (V) 12
En = Low, En = High or VCC = 0 V 0 20 40 TA, AMBIENT TEMPERATURE (C) 60 85
Figure 13. Output Leakage Current versus Output Voltage
Figure 14. Output Leakage Current versus Temperature
5.0 IOS , SHORT CIRCUIT CURRENT (mA) 0 I in , INPUT CURRENT ( A) - 5.0 - 10 - 15 - 20 - 25 - 0.5 4.75 p VCC p 5.25 V TA = 25C Enable Pins Driver Inputs
150 Normally Low Output 90
30 0 - 30 Normally High Output
-9 0 -3.0
TA = 25C 4.75 p VCC p 5.25 V 1.0 5.0 9.0 Vz, APPLIED OUTPUT VOLTAGE (V) 12
0.5
1.5 2.5 3.5 Vin, INPUT VOLTAGE (V)
4.5
5.5
-150 -7.0
Figure 15. Input Current versus Input Voltage
Figure 16. Short Circuit Current versus Common Mode Voltage
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MC75172B, MC75174B
APPLICATIONS INFORMATION
Description
The MC75172B and MC75174B are differential line drivers designed to comply with EIA-485 Standard (April 1983) for use in balanced digital multipoint systems containing multiple drivers. The drivers also comply with EIA-422-A and CCITT Recommendations V.11 and X.27. The drivers meet the EIA-485 requirement for protection from damage in the event that two or more drivers attempt to transmit data simultaneously on the same cable. Data rates in excess of 10 MBPS are possible, depending on the cable length and cable characteristics. A single power supply, 5.0 V, 5%, is required at a nominal current of 60 mA, plus load currents.
Outputs
The drivers are protected from short circuits by two methods: a) Current limiting is provided at each output, in both the source and sink direction, for shorts to any voltage within the range of 12V to -7.0V, with respect to circuit ground (see Figure 16). The short circuit current will flow until the fault is removed, or until the thermal shutdown circuit activates (see below). The current limiting circuit has a negative temperature coefficient and requires no resetting upon removal of the fault condition. b) A thermal shutdown circuit disables the outputs when the junction temperature reaches 150C, 20C. The thermal shutdown circuit has a hysteresis of 12C to prevent oscillations. When this circuit activates, the output stage of each driver is put into the high impedance mode, thereby shutting off the output currents. The remainder of the internal circuitry remains biased. The outputs will become active once again as the IC cools down.
Driver Inputs
Each output (when active) will be a low or a high voltage, which depends on the input state and the load current (see Table 1, 2 and Figures 7 to 10). The graphs apply to each driver, regardless of how many other drivers within the package are supplying load current.
Table 1. MC75172B Truth Table
Enables Data Input H L H L X EN H H X X L EN X X L L H Y H L H L Z Outputs Z L H L H Z
Table 2. MC75174B Truth Table
Outputs Data Input H L X Enable H H L Y H L Z Z L H Z
The driver inputs determine the state of the outputs in accordance with Tables 1 and 2. The driver inputs have a nominal threshold of 1.2 V, and their voltage must be kept within the range of 0 V to VCC for proper operation. If the voltage is taken more than 0.5 V below ground, excessive currents will flow, and proper operation of the drivers will be affected. An open pin is equivalent to a logic high, but good design practices dictate that inputs should never be left open. The characteristics of the driver inputs are shown in Figure 15. This graph is not affected by the state of the Enable pins.
Enable Logic
H = Logic high, L = Logic low, X = Irrelevant, Z = High impedance
The two outputs of a driver are always complementary. A "high" output can only source current out, while a "low" output can only sink current (except for short circuit current - see Figure 16). The outputs will be in the high impedance mode when: a) the Enable inputs are set according to Table 1 or 2; b) VCC is less than 1.5 V; c) the junction temperature exceeds the trip point of the thermal shutdown circuit (see below). When in this condition, the output's source and sink capability are shut off, and only leakage currents will flow (see Figures 13, 14). Disabled outputs may be taken to any voltage between -7.0 V and 12 V without damage.
Each driver's outputs are active when the Enable inputs (Pins 4 and 12) are true according to Tables 1 and 2. The Enable inputs have a nominal threshold of 1.2 V and their voltage must be kept within the range of 0 V to VCC for proper operation. If the voltage is taken more than 0.5 V below ground, excessive currents will flow, and proper operation of the drivers will be affected. An open pin is equivalent to a logic high, but good design practices dictate that inputs should never be left open. The Enable input characteristics are shown in Figure 15.
Operating Temperature Range
The minimum ambient operating temperature is listed as -40C to meet EIA-485 specifications, and 0C to meet EIA-422-A specifications. The higher VOD required by EIA-422-A is the reason for the narrower temperature range.
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MC75172B, MC75174B
The maximum ambient operating temperature (applicable to both EIA-485 and EIA-422-A) is listed as 85C. However, a lower ambient may be required depending on system use (i.e. specifically how many drivers within a package are used) and at what current levels they are operating. The maximum power which may be dissipated within the package is determined by:
PDmax + T -T Jmax A R qJA
drivers. From Figures 8 and 10 (adjusted for VCC = 5.0 V), VOL [1.38 V, and VOH [4.27 V. The power dissipated in each driver is: {(5.0 - 4.27) * 0.020} + (1.38 * 0.0278) = 53 mW Since each driver dissipates 53 mW, the use of all four drivers in a package would be marginal. Options include reducing the load current, reducing the ambient temperature, and/or providing a heat sink.
System Requirements
where:
RqJA = package thermal resistance (typical 70C/W for the DIP package, 85C/W for SOIC package); TJmax = max. operating junction temperature, and TA = ambient temperature.
EIA-485 requires each driver to be capable of transmitting data differentially to at least 32 unit loads, plus an equivalent DC termination resistance of 60W, over a common mode voltage of -7.0 to 12 V. A unit load (U.L.), as defined by EIA-485, is shown in Figure 17.
I 1.0 mA
Since the thermal shutdown feature has a trip point of 150C, 20C, TJmax is selected to be 130C. The power dissipated within the package is calculated from: PD where: = {[(VCC - VOH) * IOH] + VOL * IOL)} each driver = + (VCC * ICC) VCC = the supply voltage; VOH, VOL are measured or estimated from Figures 7 to 10; ICC = the quiescent power supply current (typical 60 mA).
-7.0 V
-3.0 V V 5.0 V -0.8 mA 12 V
Reprinted from EIA-485, Electronic Industries Association, Washington,DC.
Figure 17. Unit Load Definition
As indicated in the equation, the first term (in brackets) must be calculated and summed for each of the four drivers, while the last term is common to the entire package. Example 1: TA = 25C, IOL = IOH = 55 mA for each driver, VCC = 5.0 V, DIP package. How many drivers per package can be used? Maximum allowable power dissipation is:
PD max + 130C * 25C + 1.5 W 70C W
Since the power supply current of 60 mA dissipates 300 mW, that leaves 1.2 W (1.5 W - 0.3 W) for the drivers. From Figures 7 and 9, VOL [1.75 V, and VOH [3.85 V. The power dissipated in each driver is: {(5.0 - 3.85) * 0.055} + (1.75 * 0.055) = 160 mW. Since each driver dissipates 160 mW, the four drivers per package could be used in this application. Example 2: TA = 85C, IOL = 27.8 mA, IOH = 20 mA for each driver, VCC = 5.0 V, SOIC package. How many drivers per package can be used? Maximum allowable power dissipation is:
PDmax + 130C * 85C + 0.53 W 85C W
A load current within the shaded regions represents an impedance of less than one U.L., while a load current of a magnitude outside the shaded area is greater than one U.L. A system's total load is the sum of the unit load equivalents of each receiver's input current, and each disabled driver's output leakage current. The 60W termination resistance mentioned above allows for two 120W terminating resistors. Using the EIA-485 requirements (worst case limits), and the graphs of Figures 7 and 9, it can be determined that the maximum current an MC75172B or MC75174B driver will source or sink is [65 mA.
System Example
Since the power supply current of 60 mA dissipates 300 mW, that leaves 230 mW (530 mW - 300 mW) for the
An example of a typical EIA-485 system is shown in Figure 18. In this example, it is assumed each receiver's input characteristics correspond to 1.0 U.L. as defined in Figure 17. Each "off" driver, with a maximum leakage of 50 mA over the common mode range, presents a load of [0.06 U.L. The total load for the active driver is therefore 8.3 unit loads, plus the parallel combination of the two terminating resistors (60W). It is up to the system software to control the driver Enable pins to ensure that only one driver is active at any time.
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MC75172B, MC75174B
Termination Resistors
Transmission line theory states that, in order to preserve the shape and integrity of a waveform traveling along a cable, the cable must be terminated in an impedance equal to its characteristic impedance. In a system such as that depicted in Figure 18, in which data can travel in both directions, both physical ends of the cable must be terminated. Stubs, leading to each receiver and driver, should be as short as possible.
Leaving off the terminations will generally result in reflections which can have amplitudes of several volts above VCC or below ground. These overshoots and undershoots can disrupt the driver and/or receiver operation, create false data, and in some cases damage components on the bus.
En R #1 En TTL D #1 5 "off" drivers (@ 0.06 U.L. each), +8 receivers (@ 1.0 U.L. each) = 8.3 Unit Loads RT = 120 W at each end of the cable. En TTL D #2 TTL #3 R RT 120 W Twisted Pair TTL R #2 TTL TTL D #3
En TTL D #4
TTL R #6 En TTL D #6 RT TTL #4
R
En TTL #8 NOTES: R R #7 TTL R #5 TTL TTL D #5
1.Terminating resistors RT must be located at the physical ends of the cable. 2.Stubs should be as short as possible. 3.Circuit ground of all drivers and receivers must be connected via a dedicated wire within the cable. Do not rely on chassis ground or power line ground.
Figure 18. Typical EIA-485 System
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MC75172B, MC75174B
COMPARING SYSTEM REQUIREMENTS
Characteristic GENERATOR (Driver) Output Impedance (Note 1) Open Circuit Voltage Differential Single-Ended Loaded Differential Voltage Differential Voltage Balance Output Common Mode Range Offset Voltage Offset Voltage Balance Short Circuit Current Leakage Current (VCC = 0) Output Rise/Fall Time (Note 2) RECEIVER Input Sensitivity Input Bias Voltage Input Common Mode Range Dynamic Input Impedance Vth Vbias Vcm Rin 200 mV p 3.0 V -7.0 to 12 V Spec number of U.L. 200 mV p 3.0 V -7.0 to 7.0 V q 4 kW 300 mV p 3.0 V -7.0 to 7.0 V q 4 kW Zout VOCD VOCS VOD DVOD VCM VOS DVOS IOS IOLK tr, tf Not Specified 1.5 to 6.0 V t 6.0 V 1.5 to 5.0 V, w/54 W load t 200 mV -7.0 to +12 V -1.0 t VOS t 3.0 V t 200 mV p 250 mA for -7.0 to 12 V Not Specified p 0.3 TB, w/54 W/1150 pF load t 100 W p 6.0 V p 6.0 V q 2.0 V or q 0.5 VOCD, w/100 W load p 400 mV Not Specified p 3.0 V p 400 mV p 150 mA to ground p 100 mA to -0.25 V thru 6.0 V p 0.1 TB or p 20 ns, w/100 W load 50 10 100 W p 6.0 V, w/3.9 kW, Load p 6.0 V, w/3.9 kW, Load q 2.0 V or q 0.5 VOCD, w/100 W load t 400 mV Not Specified p 3.0 V t 400 mV p 150 mA to ground p 100 mA to 0.25 V p 0.1 TB or p 20 ns, w/100 W load Symbol EIA-485 EIA-422-A V.11 and X.27
NOTES: 1. Compliance with V.11 and X.27 (Blue book) output impedance requires external resistors in series with the outputs of the MC75172B and MC75174B. 2. TB = Bit time.
Additional Information
Copies of the EIA Recommendations (EIA-485 and EIA-422-A) can be obtained from the Electronics Industries Association, Washington, D.C. (202-457-4966). Copies of the CCITT Recommendations (V.11 and X.27) can be obtained from the United States Department of Commerce, Springfield, VA (703-487-4600).
ORDERING INFORMATION
Device MC75172BDW MC75172BDWG MC75172BDWR2 MC75172BDWR2G MC75174BDW MC75174BDWG MC75174BDWR2 MC75174BDWR2G MC75174BP MC75174BPG TA = - 40 to +85C Operating Temperature Range Package SOIC-20WB SOIC-20WB (Pb-Free) SOIC-20WB SOIC-20WB (Pb-Free) SOIC-20WB SOIC-20WB (Pb-Free) SOIC-20WB SOIC-20WB (Pb-Free) PDIP-16 PDIP-16 (Pb-Free) 25 Units / Rail 1000 / Tape & Reel 38 Units / Rail 1000 / Tape & Reel 38 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC75172B, MC75174B
PACKAGE DIMENSIONS
SOIC-20 WB DW SUFFIX PLASTIC PACKAGE CASE 751D-05 ISSUE G
D
A
11 X 45 _
q
H
M
B
M
20
10X
0.25
E
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
1
10
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
h
18X
e
A1
T
C
PDIP-16 P SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE T
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
B
1 8
F S
L
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
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MC75172B, MC75174B
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
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MC75172B/D

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